Advanced Semiconductor Solutions

To make people’s everyday life different with a little chip

SiliconHub delivers world-class tape-out, chip design, and Design flow infrastructure services — empowering innovation from concept to silicon.

Explore Our Services

Our Core Values

Guiding every decision, relationship, and project

Service Excellence

We deliver beyond expectations — with precision, accountability, and relentless customer focus.

Innovation

We embrace cutting-edge methodologies, tools, and thinking to solve tomorrow’s silicon challenges today.

Integrity

We build trust through transparency, ethical conduct, and unwavering commitment to quality and IP security.

Dynamic

We move fast, adapt quickly, and thrive in the evolving pace of semiconductor development and global markets.

Global Presence, Local Expertise

Headquartered in Singapore with R&D and technical support hubs in both Singapore and Shanghai, SiliconHub operates at the intersection of East and West — combining deep regional knowledge with global best practices.

We serve clients across Asia, North America, and Europe — from startups building their first ASIC to Fortune 500 companies scaling next-generation SoCs.

Our collaborative model ensures seamless cross-border engineering, real-time technical support, and culturally intelligent project management.

Get in Touch Today

Our Headquarters

Primz Bizhub, #05-36,
Siliconhub,
Singapore 737854
R&D Hubs:
• Singapore
• Shanghai
+65 6808 1234
info@siliconhub.com

Comprehensive Semiconductor Services

Tailored solutions for every stage of the chip development lifecycle

Tape-Out Services — From Final Netlist to Fabrication-Ready GDSII

Our tape-out service is engineered for reliability, speed, and zero surprises — turning your verified design into production-ready silicon with rigorous sign-off readiness.

Key Capabilities

  • Full Flow Sign-Off: DRC/LVS/ERC/ANTENNA checks with foundry-certified rule decks (TSMC, UMC, SMIC, GlobalFoundries, Samsung)
  • Multi-Project Wafer (MPW) Management: End-to-end coordination with ITRI, CIC, MOSIS, and commercial MPW shuttles
  • Design for Manufacturability (DFM): Optical proximity correction (OPC), dummy fill, litho-friendly layout optimization
  • GDSII Generation & Validation: Layer mapping, hierarchy flattening, polygon integrity verification
  • Foundry Interface & Submission: Secure submission portals, PDK version control, ECO tracking, and post-submission support
  • Post-Tape-Out Support: Mask review assistance, wafer lot tracking, early test vector handoff, and first silicon debug coordination

Why Choose Our Tape-Out?

  • Zero-sign-off iteration guarantee (with pre-tape-out gate-level netlist validation)
  • Dedicated tape-out engineers co-located with major foundries’ APAC support teams
  • Turnaround time as low as 5 business days for mature nodes (180nm–40nm), 10 days for advanced nodes (28nm–5nm)
  • Fully documented audit trail compliant with ISO 9001 and automotive AEC-Q100 requirements

Our Tape-Out Process

1

Pre-Check & Handoff

Netlist, LEF/DEF, constraints, test plans, and documentation review

2

Physical Verification

Multi-pass DRC/LVS with hierarchical error reporting and auto-fix guidance

3

DFM & Layout Enhancement

Fill insertion, density balancing, and litho simulation (Calibre LFD)

4

GDSII Generation & Final Audit

Layer mapping, hierarchy cleanup, and final sign-off report generation

Chip Design Services — Architecture to RTL to Physical Implementation

We provide full-spectrum chip design services — from high-level architecture definition to silicon-proven physical implementation — for ASICs, SoCs, and custom IP blocks.

Scope of Work

  • Architecture & Specification: Microarchitecture exploration, power/performance/area (PPA) trade studies, interface definition (AMBA, PCIe, USB, MIPI, etc.)
  • RTL Design & Verification: Synthesizable Verilog/VHDL, UVM-based testbenches, coverage-driven verification, formal equivalence checking
  • ASIC Implementation: Synthesis (Synopsys DC), STA (PrimeTime), place-and-route (Innovus), sign-off timing/power analysis
  • Analog/Mixed-Signal Design: Custom circuit design (opamps, PLLs, ADC/DAC), schematic capture, Spectre/AMS simulation, layout (Virtuoso), extraction
  • SoC Integration: Subsystem integration, bus matrix design, clock/reset domain crossing, power management unit (PMU) integration
  • Hardware Acceleration & FPGA Prototyping: RTL porting, emulation setup (Palladium/Z1), firmware co-verification, bring-up support

Design Node Support

  • Mature Nodes: 180nm, 130nm, 90nm, 65nm
  • Advanced Nodes: 40nm, 28nm, 16/14nm FinFET, 12nm, 7nm, 5nm (via foundry partnerships)
  • Specialty Processes: BCD, SiGe, FD-SOI,CIS,MEMS interfaces

IP Portfolio Highlights

  • ADC,AFE,Low-power DDR controllers (LPDDR4/5), PCIe Gen4/5 PHYs & controllers
  • Security IP: AES-256, SHA-2, TRNG, secure boot ROM, key management units
  • AI/ML Accelerators: Sparse tensor engines, quantized inference cores (INT4/INT8)
  • Custom Interfaces: MIPI CSI-2/DSI, USB 3.2, HDMI 2.1, SATA 3.0

Design flow Infrastructure Services — Scalable, Secure, Optimized Design Environments

We deploy and manage enterprise-grade EDA infrastructure — ensuring maximum productivity, license efficiency, data integrity, and uptime for global design teams.

Core Offerings

  • HPC Cluster Deployment: Turnkey EDA compute clusters (Linux-based) optimized for synthesis, PnR, simulation, and verification workloads — supporting Cadence, Synopsys, Siemens EDA, and open-source tools
  • EDA License Management: Centralized FlexNet/Sentinel server deployment, usage analytics, cost allocation dashboards, automated renewal alerts
  • Design Data Management (DDM): Integration with Git LFS, Perforce Helix Core, or Siemens Teamcenter — including version control, branching strategy, and release gates
  • Cloud EDA Enablement: AWS EC2/Azure VM-based EDA environments with persistent storage, secure VDI access, and hybrid burst capability
  • CAD Automation & Scripting: Custom Tcl/Python scripts for regression automation, tool configuration standardization, flow orchestration (Jenkins, GitLab CI)
  • Security & Compliance: SOC 2-aligned access controls, encrypted design databases, audit logging, vulnerability scanning, and patch management

Infrastructure Highlights

  • Support for more than 100 concurrent EDA users across distributed teams
  • Typical deployment time: 10–14 business days (on-prem or cloud)
  • 99.9% SLA for critical design servers (monitored 24/7)
  • Automated backup with geo-redundant storage (Singapore + Shanghai)
  • On-demand training for EDA tool administrators and designers

Supported Tools（CAD support only）

Cadence: Innovus, Genus, Tempus, Xcelium, JasperGold, Virtuoso, Spectre
Synopsys: Design Compiler, IC Compiler II, PrimeTime, VCS, VC Formal, Custom Compiler
Siemens EDA: Calibre, Questa, ModelSim, Tessent
Open Source: Yosys, OpenROAD, Magic, ngspice, KLayout